6A2 Resin Bond Diamond Grinding Wheel 150mm Grit 120 For Ceramic Silicon Wafer

6A2 Resin Bond Diamond Grinding Wheel 150mm for Ceramic, Silicon and Thermal Spray Grinding

The 6A2 resin bond diamond grinding wheel handles a broad range of high-hardness materials including ceramic, silicon, glass, quartz and thermal spraying alloys. Its resin bond structure keeps the wheel cool and sharp for efficient surface grinding.

Product Highlights

• High Grinding Efficiency: Sharp cutting for fast stock removal on hard, brittle materials
• Broad Material Compatibility: Works on ceramic, silicon, glass, quartz and thermal spraying alloys
• Less Heat Generation: Resin bond limits grinding burn and protects the workpiece
• Stable Performance: Good shape retention and long service life lower cost per part

Specifications

Applications

• Ceramic and silicon wafer grinding
• Glass and quartz machining
• Thermal spraying alloy grinding

Our Advantages

• High grinding efficiency on hard materials
• Wide range of applications and materials
• Lower grinding heat and fewer burn marks
• OEM/ODM customization of size, grit and bond

OEM/ODM customization of size, grit and bond is available. Contact us for a quote and sample discussion.