Name: Hybrid Bond Diamond CNC Grinding Wheel 11V9 for Technical Ceramic Wafer Grinding
Brand: ZHENGZHOU SHINE ABRASIVES CO.,LTD
SKU: 11V9-150
Price: 125.00 USD
Availability: InStock

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Hybrid Bond Diamond CNC Grinding Wheel 11V9 for Technical Ceramic Wafer Grinding

Product Details:

Place of Origin:	Guangdong, China
Brand Name:	Shine Abrasives
Certification:	ISO 9001:2015
Model Number:	11V9-150

Payment & Shipping Terms:

Minimum Order Quantity:	2 Pieces
Price:	USD 70-180 / Piece
Packaging Details:	Shine Abrasives color box with shock-proof foam insert, export-grade corrugated carton
Delivery Time:	7-15 working days after deposit
Payment Terms:	T/T,L/C,PayPal,Western Union
Supply Ability:	1000 Pieces per Month

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Detailed Product Description

Bond Type:	Hybrid (Resin + Metal)	Abrasive Material:	Diamond
Shape:	11V9	Wheel Diameter:	150mm / 6 Inch
Wheel Bore:	31.75mm	Grit Size:	D46
Concentration:	125%	Core Material:	Aluminum / Steel
Coolant Compatibility:	Water-based & Oil-based	Application:	Technical Ceramic & Semiconductor Wafer Grinding
HS Code:	6804211000
Highlight:	Hybrid Bond Diamond CNC grinding wheel , CNC grinding wheel for ceramic wafer , 11V9 diamond grinding wheel

Hybrid Bond Diamond CNC Grinding Wheel for Technical Ceramics & Wafers

Designed for precision grinding of technical ceramics, silicon carbide and semiconductor components. The 11V9 hybrid bond diamond wheel combines the cool, free cutting of resin with the form-holding stability of metal bond, controlling heat and subsurface damage.

Key Advantages

Cool cutting for ceramics, silicon carbide and metal-ceramic composites
Excellent precision at high feed rates with minimal chipping
Maintains form and edge quality over long cycles
Suitable for water-based and oil-based coolant systems

Specifications

Bond Type	Hybrid (Resin + Metal)
Shape	11V9
Diameter	150mm / 6 inch
Bore	31.75mm
Grit Size	D46
Concentration	125%
Core Material	Aluminum / Steel

Applications

Technical ceramic and advanced ceramic grinding, silicon carbide components, semiconductor wafer edge and surface grinding, metal-ceramic composite machining.

Sizes and bond formulations can be customized. Contact us for a quote.

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Contact Person: Lenny Li

Tel: 008615003895611

Send your inquiry directly to us

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