1A1 Metal Bond Diamond Grinding Wheel 300mm D91 for Semiconductor Wafer Fine Grinding

1A1 Metal Bond Diamond Grinding Wheel 300mm D91

The 1A1 metal bond diamond grinding wheel (300mm, D91 grit) is engineered with a metal bond of high bonding strength and superior wear resistance. Strong grit retention enables stable, fine grinding of hard and brittle materials under continuous and mass production conditions.

Key Features

• High bonding strength for secure diamond grit retention
• Superior wear resistance for long-hour continuous operation
• Fine D91 grit for smooth, precise surfaces
• Excellent dimensional stability under heavy stock removal
• Consistent flatness and accuracy over extended production runs

Applications

• Semiconductor material processing
• Ceramic processing
• Stone processing
• Magnetic material processing
• Glass edge grinding

Performance under Heavy Loads

When processing volumes are large and working hours are continuous, the metal bond provides outstanding wear resistance and dimensional holding ability, ensuring stable grinding quality and fewer wheel changes.

Specifications

• Shape: 1A1
• Diameter: 300mm
• Bond Type: Metal
• Grit Size: D91
• Abrasive Material: Diamond
• HS Code: 6804211000

Custom diameters, grit sizes and profiles are available on request. Contact our team for application-specific grinding solutions.