Metal Bond Diamond Grinding Wheel for Silicon Wafer Edge Grinding

Metal bond and resin bond wheels are specifically designed for edge grinding on the outer circumference of silicon wafers. These wheels deliver uniform sharpness while maintaining precision accuracy in wheel shape and exceptional abrasion resistance. Available for both outer-circumference machining and notch machining, our wheels come in three types: single-groove, multi-groove, and composite rough finishing.

• Low maintenance requirements
• Increased production output
• Exceptional wear resistance
• Longer-lasting wheel sharpness
• Superior heat transfer from ground material
• Extended product life cycle