Shine Abrasives 1A1R Resin Bond Grinding Wheel Custom Thickness

Shine Abrasives 1A1R Diamond Grinding Wheel/resin Bonded Diamond Cut Off Wheel

Grinding characteristics of ultra-thin cutting wheels

High-precision ultra-thin cutting grinding wheels are mainly used for precision grooving and cutting. They generally use deep-cut slow-feed grinding processes. They have the characteristics of large cutting depth, low feed speed, large contact area between the grinding wheel and the workpiece, narrow slit, and high removal rate. It has the characteristics of high cutting precision, good surface quality and high material utilization.

Purpose of ultra-thin cutting grinding wheel. 

Products that can be processed by high-precision ultra-thin ultra-hard material cutting grinding wheels High-precision ultra-thin ultra-hard material cutting grinding wheels are mainly used for precision grooving and cutting of micro, precision and precious components in the field of electronic information. Specifically, it mainly includes: computer soft and hard disk heads, read-write heads, video recorder heads, etc.; integrated circuit substrates, semiconductor substrates, VCD, DVD reading system optical components, etc.; optical couplers, optical splitters, optical fiber interface components, diodes, transistors, Lead packaging tubes, etc.; chip inductors, resistors, capacitors, chip thermal components, etc.; filters, oscillators, piezoelectric crystals, sensing devices, etc.; precision molds, tools, measuring tools, etc.

 Materials that can be processed by high-precision ultra-thin ultra-hard material cutting wheels.High-precision ultra-thin ultra-hard material cutting grinding wheels are mainly used for processing hard and brittle non-metallic materials (diamond abrasives) and black difficult-to-machine metal materials (cubic boron nitride abrasives). Specifically, it mainly includes: ceramic materials, such as Al0; Zr0, SiNSiCBaTi0 CaTio, etc.; semiconductor materials, such as Si Ge GaPGaAs, GaAsP, LiNb0;, BiSb, etc.; packaged chips, such as BGA, QFN, PBGAPOFN, etc.; magnetic materials such as various soft magnetic materials , hard magnets, magnetic cores, magnetic head materials, etc.; glass materials, such as quartz glass, boron glass, phosphorus glass, soda glass, aluminum glass, etc.; metal materials, such as high-speed steel, tool steel, mold steel, bearing steel and other iron systems Metal; other materials, such as platinum wire, gemstones,carbide (tungsten steel), printed circuit boards, etc.