The diamond abrasive layer, also known as the working layer, consists of diamond abrasives, binders, and pores. It is the operational component of the grinding wheel responsible for the grinding action. Diamond serves as the primary agent in the grinding process; the binder holds the diamond particles together to form a mold with a specific geometric shape; and the pores characterize the density of the mold, directly influencing grinding efficiency and work quality while also facilitating heat dissipation and chip accommodation.The diamond abrasive layer, also known as the working layer, consists of diamond abrasives, binders, and pores. It is the operational component of the grinding wheel responsible for the grinding action. Diamond serves as the primary agent in the grinding process; the binder holds the diamond particles together to form a mold with a specific geometric shape; and the pores characterize the density of the mold, directly influencing grinding efficiency and work quality while also facilitating heat dissipation and chip accommodation.